MPi Canteliver Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is broadly utilized on gold bump and pad wafer tests for Exhibit driver, logic, and memory product. MPI’s cantilever probes are the corresponding respond to to the calls for of fi­ne pitch, smaller pad measurement, high pace, considerably less cleansing, multi-DUT, high pin depend, and extremely-minimal leakage needs. With fantastic craftsmanship, innovative architecture and verified methodologies based upon mechanical and electrical simulation/measurement outcomes, building MPI the top cantilever provider around the globe.


FCB Probe Card

The FCB Probe Card is easily the most mature technologies of buckling beam probe card. It's aimed to attain the semiconductor ship manufacture time-to-industry (TTM) and price of test (COT) demand. FCB is really a verified Option for a range of semiconductor generation tests from early engineering pilot-runs to high quantity producing (HVM). FCB is prepared for product requiring large signal integrity probing (SI) and/or ability integrity probing (PI). Apps contain chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus much more. FCB ensures the earth’s finest In general Charge-of-ownership (COO) for numerous DUT purposes.


EVS Probe Card

The EVS Probe Card is really an improvement around the conventional buckling beam probe card. Essential features are greater present-day carrying capacity (C.C.C.) and reduced well balanced Speak to power (BCF), along with In general MEMS-like attributes. EVS can easily satisfy the need of Superior wafer probing. Specific alignment and outstanding planarity Command are classified as the key click here variables contributing to secure Make contact with resistance. With its potential and overall performance, EVS Probe Card is a really perfect choice for Superior probe playing cards.


Osprey probe card

The Osprey probe card is MPI’s solution to need for at any time finer pitch. It is actually made for more compact Al pad, and is also perfect for little pitch application with peripheral and entire array pattern. With specific alignment and far better planarity Handle, Osprey can reach better efficiency by multi-DUT style.  The forming wire (FW) style needle generated with MPI’s very own micro fabrication method not only delivers superior-excellent functionality but additionally lets quick needle substitution and shortens maintaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is provided with MEMS wire (MW) needle which can be created for the need of lower power probing. What's more, it includes the opportunity to fulfill superior C.C.C. and high pin counts software. The MEMS process ensures extremely consistent needle characteristics, and the Distinctive construction design and style enables specific alignment and planarity Manage.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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